8 semiconductor processes : EDS process, 
photo process & cleaning process

IMXR® IMXR® Semiconductor Job Training VR Content 

There is a need to improve the next-generation semiconductor customized education environment in line with changes in industrial paradigm and market fluctuations. IMXR Job Training Semiconductor Process Content provides repetitive and systematic job training for semiconductor equipment processes without time and place constraints in virtual space. By implementing a virtual reality-like environment, it is designed to allow users to experience vivid visual and auditory experiences as they interact in real processes.

  · Essential Process for Maintaining Semiconductor Quality : Cleaning Process  

The cleaning process involves removing impurities from the wafer surface using chemical treatments and physical methods such as gas application. As a critical stage in semiconductor manufacturing, cleaning is one of the key processes that determine the final quality of the semiconductor. By effectively eliminating impurities on the wafer surface, it ensures the quality of subsequent processes and contributes to optimizing semiconductor performance. Repeated cleaning operations play a vital role in maintaining the quality and reliability of semiconductor processes.

Scenario Configuration

· Contents 01: Operation of Semiconductor Plasma Cleaning Process Equipment
Trainees practice the initial equipment setup, including assembling the chamber ceramics and connecting pneumatic tubes. They also learn magazine cleaning procedures, as well as pump and generator replacement methods.

· Contents 02: Operation of Semiconductor Inspection Process Equipment
Trainees gain knowledge in probe card inspection setup, probe tip fastening, rotary pump oil replacement, compressor oil refilling, and moisture removal procedures.

· Contents 03: Operation of Semiconductor Wafer Pattern Measurement Equipment
Trainees learn the initial operation of the equipment and the use of its programs.

 Contents Overview : Semiconductor Process Equipment Operation and Maintenance Procedures

[1] Learning  Plasma Cleaning Equipment  Procedures

Environment Setup: Cleanroom

• Equipment: Plasma cleaning equipment and related components
• Tools: Chamber ceramics, magazine, dry pump, generator, assembly tools

Equipment and Process Description	QUIZ
Chamber Ceramic Assembly	Power and Utility Connection

[1-1] Content Process Outline

1. Chamber Ceramic Assembly

• Ceramic Mounting: Attach four side ceramics and two ceramic plates.
• Ceramic Rail Mounting: Secure four ceramic rails using a hex wrench, springs, and eight bolts.

2. Power and Utility Connection

• Power ON: Rotate the main power switch 90 degrees clockwise to turn it on.
• Check Pump Connections: Ensure pneumatic tubes for air, argon, and nitrogen are properly connected.

3. Program Verification and Initialization

• Communication Check: Verify that the generator mode is set to "REMOTE".
• Initialization: Press the initialization button to reset the equipment.
  Open the chamber → Return elevator to original position → Move index pusher.

4. Leak and Discharge Tests

• Leak Test: Set parameters and start the test. After 10 minutes, verify pressure status.
• Discharge Test: Confirm RF power settings (100–1000 watts) and proceed with the test.

5. Magazine Placement

• Open Door: Open the equipment door and place the magazine correctly on the rails.
• Alignment Check: Ensure magazine slots are properly aligned.

6. Cleaning Process

• Parameter Settings: Verify the cleaning settings.
• Start Operation: Click the start button for the cleaning process.
  Open chamber → Move slots → Return chamber to original position after completion.

7. Completion

• Confirmation: Click the confirmation button in the pop-up window to complete the cleaning process.

[1-2] Equipment Replacement Procedure in Case of Trouble

1. Pump Replacement

• Open Door : Open the rear door of the equipment.
• Power OFF :  Turn off the pump power after exiting the program.
• Disconnect Power Cable and Valve : Disconnect the power cable and valve from the pump.
• Replace Pump :  Install the new pump, then attach the valve and bracket.
• Connect Power Cable :  Connect the power cable and verify its status.

2. RF Generator Replacement

• Remove Cover and Power OFF : Remove the equipment cover and turn off the generator power.
• Disconnect Power and Coaxial Cables : Disconnect the power cable and coaxial cables.
• Remove Grounding and Bolts :  Remove the grounding and securing bolts.
• Replace Generator : Replace with a new generator and reassemble.

[2]  Semiconductor Inspection  System

Environment Setup: Cleanroom

• Equipment: Semiconductor inspection system and related components
• Tools: Probe tips, probe cards, rotary pump, compressor, operating oil, assembly tools

Equipment and Process Description	QUIZ
Power ON	Operating Preparation

[2-1] Semiconductor Inspection System Procedure

1. Power ON

• Main Power ON : Flip the power switch to turn on the main power and verify 220V on the control panel.
• PC Power ON : Press the power button on the PC to turn it on.
• Instrument Power ON : Press the power button on the instruments to activate them.

2. Operating Preparation

• Chamber Open :  Lift the chamber door upward.
• Fix Probe Tip : Secure the probe tip by turning the brass part to attach and fix it.
• Place Wafer (Probe Card) :  Place the wafer sample inside the chamber.
• Chamber Close : Close the chamber door and secure it by turning clockwise.
• Rotary Pump On : Turn on the rotary pump switch.
• Open Angle Valve :  Open the angle valve and check the vacuum level (745–755 TORR).
• Light Button ON : Switch on the light.
• Adjust Microscope : Center the microscope and adjust the magnification.
• Contact Operation : Adjust the XYZ axis using the positioner to make contact between the wafer and the probe tip.
• Chuck Controller ON : Use the chuck controller to set the temperature.

3. Measurement Execution

• SET Button on Monitor Screen : Turn off the chuck controller by lowering the power switch.
• Check Results : Use the positioner to release the contact between the wafer and the probe tip.

4. Final Steps

• Chuck  Controller OFF : Shut off the angle valve by lowering it.
• Release Contact :  Use the positioner to release the contact between the wafer and the probe tip.
• Close Angle Valve : Shut off the angle valve by lowering it.
• Vent Valve ON :  Activate the vent valve to release the vacuum state.
• Rotary Pump OFF :  Turn off the rotary pump switch.
• Light Button OFF : Switch off the light.
• Move Microscope : Push the microscope to the side.
• Chamber Open :  Open the chamber door.
• Remove Wafer : Take out the wafer sample.

5.  Power OFF

• Instrument Power OFF : Press the instrument power button to turn it off.
• PC Power OFF : Press the PC power button to turn it off.
• Main Power OFF :  Lower the main power switch and confirm 0V on the control panel.

6. Maintenance.

• Rotary Pump Oil Replacement :

          - Check the oil condition. (Normal: transparent, Replacement needed: brown)

          - Drain the old oil, refill with new oil, and securely close the cap.

• Compressor Oil Refill and Moisture Removal :

          - Check the oil gauge and refill oil if necessary.

          - Open the moisture removal valve to drain water.

[3]  Pattern Shape Measuring  Instrument

Environment Setup : Cleanroom

• Equipment: Pattern Shape Measuring Instrument
• Tools: Wafer

Power ON	Operating preparation
Equipment and Process Description	Pattern Shape Measurement

[3-1] Procedure Outline

1. Power ON

• Equipment Power ON : urn on the power switch of the pattern shape measuring instrument.
• Main Power ON :  Turn on the main power button, and check the indicator light and pressure gauge values.
• PC Power ON :  Press the PC power button, and verify the monitor and program execution status.

2. . Operating Preparation

• Place Wafer :  Position the wafer to be measured inside the equipment.
• Close Equipment Door : Close the equipment door.

3. Pattern Shape Measuring Instrument Operation

• Lock Door : Click the door lock button in the program to secure the door.
• Set Origin : Set the origin, then click the drive button.
• Activate Lift : Click the lift button to secure the wafer.
• Set Vacuum :  Click the vacuum button and select the dimension matching the wafer size (6/8/12 inches).

4. Pattern Shape Measurement

• Load Recipe : Load the recipe file.
• Select and Move Coordinates : Select alignment coordinates, then click the move button.
• Register Alignment Coordinates : Register the alignment coordinates in the program interface.
• Proceed with Measurement : Click the inspection button to begin measurement and review the resulting graph.

5. Click the inspection button to begin measurement and review the resulting graph

• Return to Original Position : Click the insertion button to return the equipment to its original position.
• Release Vacuum State : Click the vacuum button to release the vacuum.
• Release Lift : Click the lift button to elevate the wafer.
• Unlock Door : Click the door unlock button.

6. Final Steps

• Open Equipment Door : Open the equipment door.
• Remove Wafer : Remove the measured wafer from the equipment.

Korea Polytechnic University Gwangju Campus VR Lab

Features

· Optimized performance with live-action high-quality modeling and optimization technology

We increase trainees’ sense of immersion through high-resolution modeling based on real-time images, and based on Samwoo Immersion’s patented technology, we create user-centered content by optimizing the delay that occurs when using content.

· Next-generation semiconductor process job training content based on systematic planning procedures 

Maximizes the experience effect by performing the same interaction as the actual process through user-centered UI/UX. Increase understanding of semiconductor processing procedures through narration, subtitles, and theoretical explanations related to the process.

· Supply of integrated management program for VR education and training equipment

Convenience of educational content selection and simultaneous control is supported by establishing an integrated control system environment. Remote execution of scenarios and client (student) status information allow instructors to manage and control trainees’ training.

Contents planning elements

· Increase training effectiveness and induce high immersion based on systematic planning procedures used in NCS and industrial safety training scenarios

· Semiconductor processing equipment operation process

1. Wafer manufacturing: Cut silicon ingots into round wafers.

2. Oxidation: Forming a silicon oxide film on the wafer surface

3. Photo: Engraving a semiconductor circuit on a wafer using light

4. Etching: Removal of the remaining portion (oxide film) excluding the circuit pattern

5. Deposition, ion implantation: .After making a thin film, ion implantation to have electrical properties

6. Metal wiring: Connect the electric path (metal wire) according to the circuit pattern

7. Test (EDS): Inspects each chip (die) on the wafer to eliminate defective products

8. Packaging: Cut the chips on the wafer into individual pieces and apply a protective film to complete the semiconductor

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