Semiconductor 8 Major Processes: Photolithography Process, Etching Process
IMXR® Semiconductor Job Training VR Content


There is a need to improve the next-generation semiconductor customized education environment in line with changes in industrial paradigm and market fluctuations.
IMXR Job Training Semiconductor Process Content provides repetitive and systematic job training for semiconductor equipment processes without time and place constraints in virtual space. By implementing a virtual reality-like environment, it is designed to allow users to experience vivid visual and auditory experiences as they interact in real processes..
Contents Overvie
Learners experience the RF Sputter process, part of the Deposition & Ion Process, and the Lithography process, part of the Photolithography Process, in procedures identical to actual manufacturing processes. This enables them to understand the RF Sputter and Lithography processes thoroughly and become familiar with the equipment used, thereby enhancing their practical skills.
· Ion & Deposition Process: RF Sputter Process
A process that enables the deposition of various thin films through the RF Sputter operating principle and Sputter Target replacement.
Learn the plasma gold thin-film deposition process using RF Sputter equipment.
· Photolithography Process: Lithography Process
Learn about the photolithography process, which involves forming patterns on a wafer using light. The process includes the following steps: HMDS Coating, PR Coating, Baking, Mask Align & Exposure, Development, and Inspection.
Features
· Real-World Based High-Quality Modeling: Mobile-Based High-Quality Mesh and Texture Optimization
We increase trainees’ sense of immersion through high-resolution modeling based on real-time images, and based on Samwoo Immersion’s patented technology, we create user-centered content by optimizing the delay that occurs when using content.
RF Sputter |
Real Photograph | 3D Modeling
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Lithography |
Real Photograph | 3D Modeling |

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· Next-generation semiconductor process job training content based on systematic planning procedures
Maximizes the experience effect by performing the same interaction as the actual process through user-centered UI/UX. Increase understanding of semiconductor processing procedures through narration, subtitles, and theoretical explanations related to the process

Maximized Learning Experience
| By providing interactions similar to actual process procedures, trainees can engage in highly realistic and immersive learning. |
Enhanced Understanding
| Through narration, subtitles, and theoretical explanations, even complex semiconductor process procedures become easy to grasp and master. |
User-Friendly Design
| Intuitive, user-centered UI/UX creates a convenient learning environment, ensuring maximum educational effectiveness.
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Efficient Learning
| Systematic planning ensures well-structured content, enabling learners to achieve their goals with ease. |
· Supply of integrated management program for VR education and training equipment
Convenience of educational content selection and simultaneous control is supported by establishing an integrated control system environment. Remote execution of scenarios and client (student) status information allow instructors to manage and control trainees’ training.

Centralized Management
| Streamline preparation and execution by integrating the management of educational content and scenarios in one place. |
Real-Time Monitoring
| Track trainees’ status in real time and provide immediate feedback.
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Efficient Scenario Execution
| Manage multiple trainees simultaneously while delivering a consistent educational experience.
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Time and Resource Savings
| Reduce preparation time and optimize resource utilization through an automated management system. |
Improved Training Quality
| Maximize learning outcomes with tailored feedback and prompt interventions. |
Flexibility and Scalability
| Easily update or expand educational content, and scale the system to accommodate varying numbers of trainees. |
Contents planning elements
· Increase training effectiveness and induce high immersion based on systematic planning procedures used in NCS and industrial safety training scenarios

· Semiconductor processing equipment operation process

Wafer manufacturing: Cut silicon ingots into round wafers
Oxidation: Forming a silicon oxide film on the wafer surface
Photo: Engraving a semiconductor circuit on a wafer using light
Etching: Removal of the remaining portion (oxide film) excluding the circuit pattern
Deposition, ion implantation: After making a thin film, ion implantation to have electrical properties
Metal wiring: Connect the electric path (metal wire) according to the circuit pattern
Test (EDS): Inspects each chip (die) on the wafer to eliminate defective products
Packaging: Cut the chips on the wafer into individual pieces and apply a protective film to complete the semiconductor
Recommended specifications and specs of content

Usage l 
Semiconductor 8 Major Processes: Photolithography Process, Etching Process
IMXR® Semiconductor Job Training VR Content
There is a need to improve the next-generation semiconductor customized education environment in line with changes in industrial paradigm and market fluctuations.
IMXR Job Training Semiconductor Process Content provides repetitive and systematic job training for semiconductor equipment processes without time and place constraints in virtual space. By implementing a virtual reality-like environment, it is designed to allow users to experience vivid visual and auditory experiences as they interact in real processes..
Learners experience the RF Sputter process, part of the Deposition & Ion Process, and the Lithography process, part of the Photolithography Process, in procedures identical to actual manufacturing processes. This enables them to understand the RF Sputter and Lithography processes thoroughly and become familiar with the equipment used, thereby enhancing their practical skills.
· Ion & Deposition Process: RF Sputter Process
A process that enables the deposition of various thin films through the RF Sputter operating principle and Sputter Target replacement.
Learn the plasma gold thin-film deposition process using RF Sputter equipment.
· Photolithography Process: Lithography Process
Learn about the photolithography process, which involves forming patterns on a wafer using light. The process includes the following steps: HMDS Coating, PR Coating, Baking, Mask Align & Exposure, Development, and Inspection.
· Real-World Based High-Quality Modeling: Mobile-Based High-Quality Mesh and Texture Optimization
We increase trainees’ sense of immersion through high-resolution modeling based on real-time images, and based on Samwoo Immersion’s patented technology, we create user-centered content by optimizing the delay that occurs when using content.
· Next-generation semiconductor process job training content based on systematic planning procedures
Maximizes the experience effect by performing the same interaction as the actual process through user-centered UI/UX. Increase understanding of semiconductor processing procedures through narration, subtitles, and theoretical explanations related to the process
· Supply of integrated management program for VR education and training equipment
Convenience of educational content selection and simultaneous control is supported by establishing an integrated control system environment. Remote execution of scenarios and client (student) status information allow instructors to manage and control trainees’ training.
· Increase training effectiveness and induce high immersion based on systematic planning procedures used in NCS and industrial safety training scenarios
· Semiconductor processing equipment operation process
Wafer manufacturing: Cut silicon ingots into round wafers
Oxidation: Forming a silicon oxide film on the wafer surface
Photo: Engraving a semiconductor circuit on a wafer using light
Etching: Removal of the remaining portion (oxide film) excluding the circuit pattern
Deposition, ion implantation: After making a thin film, ion implantation to have electrical properties
Metal wiring: Connect the electric path (metal wire) according to the circuit pattern
Test (EDS): Inspects each chip (die) on the wafer to eliminate defective products
Packaging: Cut the chips on the wafer into individual pieces and apply a protective film to complete the semiconductor
Usage l