MR Content for Semiconductor 8 Major Processes Tour (Miniature)

IMXR® Semiconductor Job Training VR Content

The MR content features miniature models of the core equipment used in the 8 major semiconductor processes, all displayed on a single table. This unique content allows users to observe semiconductor equipment even in limited spaces. Additionally, users can learn about the key technologies and principles of the processes through a docent's guidance and observe distinctive equipment operations. The major process steps are combined with equipment operations and explanatory UI, providing users with an immersive augmented reality experience.

Key Features

  · Real-Time Environment Recognition and Advanced Rendering  

Through real-time environment recognition and advanced rendering capabilities, the passthrough camera renders the surrounding environment in high quality, seamlessly blending reality with virtual reality. This provides a highly realistic and interactive immersive experience.

  · High-Quality 3D Graphics and Animations  

To deliver an immersive MR experience, high-quality 3D modeling is implemented in miniature form, with each equipment's operations vividly animated. Additionally, synchronized docent gestures with explanatory narration further enhance the content's immersive quality, enabling users to naturally understand the processes.

1. Miniature-Type Modeling

The 1:1 scale modeling of cleanroom equipment has been transformed into miniature types. The semiconductor equipment for the 8 major processes is displayed on a single table, allowing users to view all the equipment at a glance and explore the overall process flow and equipment details.

2. Animation

A docent introduces the 8 major semiconductor processes by synchronizing gestures and movements with the narration. The animations also highlight the operational features of the equipment, providing learners with a detailed and engaging introduction to each process.

  · Performance Optimization for Stable Frame Rates  

To ensure an immersive user experience, the content is optimized for mobile environments, maintaining a stable frame rate of at least 60 FPS. Optimization techniques include reducing the polygon count of models, applying Level of Detail (LOD), minimizing texture resolution, and utilizing baked lighting to pre-render lighting onto textures, all aimed at enhancing performance.

PC Modeling	Mobile Modeling (Applied to semiconductor MR)

Content Composition

1. Wafer Manufacturing Equipment
Process Description	Equipment Description
A process that cuts ingots into very thin and uniform thickness, then flattens the surface to create wafers.	Edge Grinder: Equipment used for polishing the edges and surface of the wafer.

2. Oxidation Process
Process Description	Equipment Description
A process that forms an oxide layer (SiO2) on the wafer surface to create a protective film.	-

3. Photolithography Process
Process Description	Equipment Description (Starting from the equipment on the left)
A process where a photosensitive material is applied to the wafer, and then light is used to form the desired pattern on the wafer surface.	1)  Exposure Process: Equipment that uses light to expose the photosensitive material in order to accurately transfer fine circuit patterns onto a semiconductor wafer. 2) Pattern Measurement System : Equipment that measures the fine pattern shapes on the wafer to reduce defects in the manufacturing process and improve production efficiency. 3) Mask Aligner :  Equipment that uses UV light to expose the wafer, transferring the pattern from the photomask onto the wafer. 4) Hot Plate : Equipment used to apply heat treatment to the wafer after a developer solution has been applied, in order to bake the developer solution. 5) Spin coater : Equipment that applies a developer solution to the wafer and spins it to coat the surface evenly with a uniform thickness. 6) Microscope : Equipment used to inspect fine patterns and defects on the wafer.

4. Etching Process
Process Description	Equipment Description (Starting from the equipment on the left)
A process where the silicon wafer is chemically or physically etched along the pattern formed in the photolithography process.	1) PCMC: After the photolithography process, the wafer is placed in the PCMC, where gases used in the process are injected in plasma form to etch away unnecessary areas on the wafer surface, leaving only the designed pattern. 2) Dry Etcher : Etching equipment that uses plasma to remove unnecessary portions of the semiconductor during the etching process.

5. Deposition & Ion Process
Process Description	Equipment Description (Starting from the equipment on the left)
A process that forms a thin film on the wafer or injects impurities to alter the electrical properties of the semiconductor.	1) RF Sputter / Plasma Sputtering : Deposition equipment used to build a layer of silicon dioxide and silicon on a wafer after the oxide layer has been removed through etching. 2) SP CVD Furnace : Equipment that uses gaseous precursor materials to deposit a thin solid film on the wafer surface.

6. Metal Wiring Process
Process Description	Equipment Description
A process of depositing metal on the wafer to create electrical connections between semiconductor devices.	-

7. EDS 공정
Process Description	Equipment Description
A process of checking whether the chips on the wafer meet the required quality standards through electrical characteristic testing and calculating the product yield.	Semiconductor Tester : Equipment used to test defective wafers by placing the wafer on a probe card and exposing it to high-precision magnification, various light sources, temperatures, and other conditions.

8.Process Description
Process Description	Equipment Description
A process of cutting the semiconductor chips from the wafer, packaging them to protect from external environments, and creating electrical connections through wiring.	-

9. Cleaning Process
Process Description	Equipment Description
Although the cleaning process is not part of the 8 major processes, it is a process that uses plasma to clean the wafer surface.	Plasma Cleaning Equipment : Equipment that uses plasma to remove residual PR (Photoresist) after the lithography process.

Technical Specifications

• Development Tools and Languages : Unreal Engine 5, C++ 및 Blueprint

• Hardware Requirements

Equipment Name	Meta Quest3	Meta Quest Pro
Image

Recommended Content Specifications and Specs